參數(shù)資料
型號: UPD7566AA
廠商: NEC Corp.
英文描述: 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述: 4位單片機
文件頁數(shù): 51/58頁
文件大小: 471K
代理商: UPD7566AA
μ
PD7566A, 7566A(A)
51
11. RECOMMENDED SOLDERING CONDITIONS
For the
μ
PD7566A, soldering must be performed under the following conditions.
For details of recommended conditions for surface mounting, refer to information document "Semiconductor
device mounting technology manual" (IEI-1207).
For other soldering methods, please consult with NEC sales personnel.
Table 11-1 Soldering Conditions of Surface Mount Type
μ
PD7566AG-XXX: 24-pin plastic SOP (300 mil)
μ
PD7566AG(A)-XXX: 24-pin plastic SOP (300 mil)
Recommended
Conditions
Reference Code
Soldering Method
Soldering Conditions
Infrared Reflow
Package peak temperature 230
°
C, Time: 30 secondes max.
(210
°
C min.), Number of soldering operations: 1,
IR30-00-1
VPS
Package peak temperature 215
°
C, Time: 40 seconds max.
(200
°
C min.), Number of soldering operations: 1
VP15-00-1
Wave Soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
Preparatory heating temperature: 120
°
C max.
(Package surface temperature)
WS60-00-1
Pin Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (Per side)
Caution
Do not use one soldering method in combination with another (however, pin partial heating can be
performed with other soldering methods).
Table 11-2 Soldering Conditions of Through-Hole Type
μ
PD7566ACS-XXX: 24-pin plastic shrink DIP (300 mil)
μ
PD7566ACS(A)-XXX: 24-pin plastic shrink DIP (300 mil)
Soldering Method
Soldering Conditions
Wave Soldering
(Only for pin part)
Solder bath temperature: 260
°
C max., Time: 10 seconds max.
Pin Partial Heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (Per pin)
Caution
The wave soldering must be performed at the pin part only. Note that the solder must not be directly
contacted to the package body.
#
相關(guān)PDF資料
PDF描述
UPD7566ACS 4-BIT SINGLE-CHIP MICROCOMPUTER
UPD7566ACSA 4-BIT SINGLE-CHIP MICROCOMPUTER
UPD7566AG 4-BIT SINGLE-CHIP MICROCOMPUTER
UPD75P316BGK-BE9 4-BIT SINGLE-CHIP MICROCOMPUTER
UPD75P316BKK-T 4-BIT SINGLE-CHIP MICROCOMPUTER
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD7566CS044 制造商:Panasonic Industrial Company 功能描述:IC
UPD75P0016CU 制造商:Renesas Electronics Corporation 功能描述:MCU 4-Bit 75XL CISC 16KB EPROM 2.5V/3.3V/5V 42-Pin SPDIP
UPD75P0016CU-A 制造商:Renesas Electronics Corporation 功能描述:MCU 4-Bit 75XL CISC 16KB EPROM 2.5V/3.3V/5V 42-Pin SPDIP 制造商:Renesas Electronics 功能描述:75XL 6MHz Cut Tape 制造商:Renesas 功能描述:MCU 4-Bit 75XL CISC 16KB EPROM 2.5V/3.3V/5V 42-Pin SPDIP
UPD75P0016GB-3BS-MTX 制造商:Renesas Electronics 功能描述:MCU 4-Bit 75XL CISC 16KB EPROM 2.5V/3.3V/5V 44-Pin PQFP
UPD75P0016GB-3BS-MTX-A 制造商:Renesas Electronics Corporation 功能描述:MCU 4-bit 75XL CISC 16KB EPROM 2.5V/3.3V/5V 44-Pin PQFP 制造商:Renesas 功能描述:MCU 4-bit 75XL CISC 16KB EPROM 2.5V/3.3V/5V 44-Pin PQFP