參數(shù)資料
型號(hào)： UPD75P108BDW
廠商： NEC Corp.
英文描述： 4-BIT SINGLE-CHIP MICROCOMPUTER
中文描述： 4位單片機(jī)
文件頁(yè)數(shù)： 6/46頁(yè)
文件大?。?/td> 381K
代理商： UPD75P108BDW
6
μ
PD75P108B
CONTENTS
1.
PIN FUNCTIONS ....................................................................................................................................
1.1
PORT PINS .....................................................................................................................................................
1.2
OTHER PINS ...................................................................................................................................................
1.3
PIN INPUT/OUTPUT CIRCUITS ...................................................................................................................
1.4
RECOMMENDED CONNECTION OF UNUSED PINS.................................................................................
1.5
CAUTION ON USING P00/INT4 PIN AND RESET PIN ..............................................................................
7
7
8
9
11
12
2.
DIFFERENCES BETWEEN
μ
PD75P108B AND
μ
PD75P116 ................................................................. 12
3.
DIFFERENCES BETWEEN MASK VERSION (
μ
PD75108) AND PROM VERSION (
μ
PD75P108B) .. 13
4.
PROM (PROGRAM MEMORY) WRITE AND VERIFY .......................................................................... 14
4.1
PROGRAM MEMORY WRITE/VERIFY OPERATING MODES ...................................................................
4.2
PROGRAM MEMORY WRITE PROCEDURE................................................................................................
4.3
PROGRAM MEMORY READ PROCEDURE .................................................................................................
4.4
ERASUER METHOD (
μ
PD75P108BDW only)..............................................................................................
4.5
SCREENING OF ONE-TIME PROM PRODUCTS.........................................................................................
14
15
16
17
17
5.
ELECTRICAL SPECIFICATIONS ............................................................................................................ 18
6.
CHARACTERISTIC CURVE (REFERENCE VALUE) .............................................................................. 30
7.
RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 36
8.
PACKAGE INFORMATION .................................................................................................................... 37
APPENDIX A. DEVELOPMENT TOOLS...................................................................................................... 39
APPENDIX B. RELATED DOCUMENTATIONS .......................................................................................... 40
APPENDIX C. FONCTIONAL DIFFERENCE AMONG
μ
PD751
××
SERIES ................................................ 42
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