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參數(shù)資料
| 型號： | UPD75P216ACW |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁數(shù)： | 23/28頁 |
| 文件大小： | 281K |
| 代理商： | UPD75P216ACW |
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μ
PD75P216A
23
6.
RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met when soldering this product.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
MANUAL” (IEI-1207)
.
Please consult with our sales offices in case other soldering process is used, or in case other soldering is
done under different conditions.
Table 6-1
Type of Through Hole Device
μ
PD75P216ACW: 64-pin plastic shrink DIP (750 mil)
Soldering process
Soldering conditions
Wave soldering
(only lead part)
Solder temperature: 260
°
C or lower,
Flow time: 10 seconds or less
Partial heating
method
Pin temperature: 260
°
C or lower,
Time: 10 seconds or less
Caution
This wave soldering should be applied only to lead part, and don’t jet molten solder on the surface
of package.
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