- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄300064 > UPD75P3018AGK-9EU (NEC Corp.) Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No PDF資料下載
參數(shù)資料
| 型號： | UPD75P3018AGK-9EU |
| 廠商： | NEC Corp. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No |
| 中文描述： | 4位單片機 |
| 文件頁數(shù)： | 48/64頁 |
| 文件大?。?/td> | 356K |
| 代理商： | UPD75P3018AGK-9EU |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁當前第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁
PD75P3018A
52
Data Sheet U11917EJ2V0DS00
11. RECOMMENDED SOLDERING CONDITIONS
Solder the
PD75P3018A under the following recommended conditions.
For the details on the recommended soldering conditions, refer to Information Document Semiconductor Device
Mounting Technology Manual (C10535E).
For the soldering methods and conditions other than those recommended, consult NEC.
Table 11-1. Soldering Conditions of Surface Mount Type (1/2)
(1)
PD75P3018AGC-3B9: 80-pin plastic QFP (14 × 14 mm, resin thickness 2.7 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°C, Reflow time: 30 seconds or below (210°C
IR35-00-3
or higher), Number of reflow processes: 3 max.
VPS
Package peak temperature: 215
°C, Reflow time: 40 seconds or below (200°C
VP15-00-3
or higher), Number of reflow processes: 3 max.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or below,
WS60-00-1
Number of flow processes: 1
Preheating temperature: 120
°C or below (package surface temperature)
Partial heating
Pin temperature: 300
°C or below, Time: 3 seconds or below (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
(2)
PD75P3018AGC-8BT: 80-pin plastic QFP (14 × 14 mm, resin thickness 1.4 mm)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°C, Reflow time: 30 seconds or below (210°C
IR35-00-2
or higher), Number of reflow processes: 2 max.
VPS
Package peak temperature: 215
°C, Reflow time: 40 seconds or below (200°C
VP15-00-2
or higher), Number of reflow processes: 2 max.
Wave soldering
Solder temperature: 260
°C or below, Flow time: 10 seconds or below,
WS60-00-1
Number of flow processes: 1
Preheating temperature: 120
°C or below (package surface temperature)
Partial heating
Pin temperature: 300
°C or below, Time: 3 seconds or below (per side of device)
—
Caution
Do not use two or more soldering methods in combination (except the partial heating method).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| UPD75P3018AGK-BE9 | LJT 46C 40#20 4#16 2#8(COAX) |
| UPD780023AGK-xxx-9ET | Circular Connector; No. of Contacts:56; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-4 RoHS Compliant: No |
| UPD78011HGK-XXX-8A8 | 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64 |
| UPD78053GC-XXX-8BT | 8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQFP80 |
| UPD78322GJ-XXX-5BJ | 16-BIT, MROM, 16 MHz, MICROCONTROLLER, PQFP74 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPD75P3018AGK-BE9 | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75P3036GC-3B9-A | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75P308GF-3B9 | 制造商:Renesas Electronics Corporation 功能描述:MCU 4-Bit 75XL CISC 8064Byte PROM 5V 80-Pin PQFP |
| UPD75P308GF-3BA | 制造商:Renesas Electronics Corporation 功能描述: |
| UPD75P308GF-3BA-A | 制造商:Renesas Electronics Corporation 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。