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參數(shù)資料
| 型號： | UPD75P336 |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁數(shù)： | 36/40頁 |
| 文件大?。?/td> | 320K |
| 代理商： | UPD75P336 |
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36
μ
PD75P048
8. RECOMMENDED SOLDERING CONDITIONS
It is recommended that
μ
PD75P048 be soldered under the following conditions. For details on the recommended
soldering conditions, refer to Information Document "Semiconductor Devices Mounting Manual" (IEI-1207). For
other soldering methods and conditions, consult NEC.
Table 8-1 Soldering Conditions of Surface-Mount Type
μ
PD75P048GC-AB8: 64-pin plastic QFP (
14 mm)
Soldering Method
Soldering Conditions
Symbol for Recommended
Condition
IR35-00-2
Infrared Reflow
Package peak temperature: 235
°
C,
time: 30 seconds max. (210
°
C min.),
number of times: 2 max.
<Caution>
(1) Start second reflow after device temperature
(which has risen because of first reflow) has returned to
room temperature.
(2) Do not clean flux with water after first reflow.
Package peak temperature: 215
°
C,
time: 40 seconds max. (200
°
C min.),
number of times: 1 max.
<Caution>
(1) Start second reflow after device temperature
(which has risen because of first reflow) has returned to
room temperature.
(2) Do not clean flux with water after first reflow.
Pin temperature: 300
°
C max.,
time: 3 seconds max. (per side)
VPS
VP15-00-2
Pin Partial Heating
—
Caution Do not use two or more soldering methods in combination (except the pin partial heating method).
Table 8-2 Soldering Conditions of Through-Hole Type
μ
PD75P048CW: 64-pin plastic shrink DIP (750 mil)
Soldering Method
Wave soldering
(lead parts only)
Pin Partial Heating
Soldering Conditions
Soldering bath temperature: 260
°
C max.,
time: 10 seconds max.,
Pin temperature: 260
o
C max.,
time: 10 seconds max.
Caution The wave soldering must be performed at the lead part only. Note that the soldering must not be
directly contacted to the board.
#
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