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參數(shù)資料
| 型號： | UPD77016 |
| 廠商： | NEC Corp. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 16 bits, Fixed-point Digital Signal Processor |
| 中文描述： | 16位定點(diǎn)數(shù)字信號處理器 |
| 文件頁數(shù)： | 51/56頁 |
| 文件大?。?/td> | 250K |
| 代理商： | UPD77016 |
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μ
PD77016
51
6. RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other
soldering processes are used, or if the soldering is performed under different conditions, please make sure to
consult with our sales offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface mount device
μ
PD77016GM-KMD: 160-pin plastic QFP (FINE PITCH) (24
×
24 mm)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235 °C or below (Package surface temperature),
IR35-207-1
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time,
Exposure limit
Note
: 7 days (20 hours pre-baking is required at 125 °C
afterwards).
VPS
Peak temperature: 215 °C or below (Package surface temperature),
VP15-207-1
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time,
Exposure limit
Note
: 7 days (20 hours pre-baking is required at 125 °C
afterwards).
Partial heating method
Pin temperature: 300 °C or below,
–
Heat time: 3 seconds or less (Per each side of the device).
Note
Maximum allowable time from taking the soldering package out of dry pack to soldering.
Storage conditions: 25 °C and relative humidity of 65 % or less.
Caution
Apply only one kind of soldering condition to a device, except for “partial heating method”,
or the device will be damaged by heat stress.
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