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參數(shù)資料
| 型號： | UPD77016GM-KMD |
| 廠商： | NEC Corp. |
| 元件分類： | 數(shù)字信號處理 |
| 英文描述： | 16 bits, Fixed-point Digital Signal Processor |
| 中文描述： | 16位定點數(shù)字信號處理器 |
| 文件頁數(shù)： | 8/56頁 |
| 文件大?。?/td> | 250K |
| 代理商： | UPD77016GM-KMD |
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μ
PD77016
8
CONTENTS
1.
PIN FUNCTIONS...............................................................................................................................
1.1
Pin Functions...........................................................................................................................................
1.2
Recommended Connection for Unused Pins ....................................................................................... 14
9
9
2.
FUNCTIONS...................................................................................................................................... 15
2.1
Pipeline Processing ................................................................................................................................ 15
2.1.1
Outline ........................................................................................................................................... 15
2.1.2
Instructions with Delay .................................................................................................................. 15
2.2
Program Control Unit.............................................................................................................................. 16
2.3
Operation Unit ......................................................................................................................................... 16
2.3.1
General register (R0 to R7) ........................................................................................................... 16
2.3.2
MAC: Multiply ACcumulator ......................................................................................................... 17
2.3.3
ALU: Arithmetic Logic Unit ........................................................................................................... 17
2.3.4
BSFT: Barrel ShiFTer................................................................................................................... 17
2.3.5
SAC: Shifter And Count Circuit .................................................................................................... 17
2.3.6
CJC: Condition Judge Circuit ....................................................................................................... 17
2.4
Memory..................................................................................................................................................... 18
2.4.1
Instruction RAM Outline ................................................................................................................ 19
2.4.2
Data Memory Outline .................................................................................................................... 19
2.4.3
Data Memory Addressing.............................................................................................................. 19
2.5
On-chip Peripheral Circuit...................................................................................................................... 20
2.5.1
Serial Interface Outline.................................................................................................................. 20
2.5.2
Host Interface Outline.................................................................................................................... 20
2.5.3
General Input/output Ports Outline................................................................................................ 20
2.5.4
Wait Cycle Register....................................................................................................................... 20
3.
INSTRUCTIONS................................................................................................................................ 21
3.1
Outline ...................................................................................................................................................... 21
3.2
Instruction Set and Operation................................................................................................................ 22
4.
ELECTRICAL SPECIFICATIONS..................................................................................................... 29
5.
PACKAGE DRAWING ...................................................................................................................... 50
6.
RECOMMENDED SOLDERING CONDITIONS................................................................................ 51
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