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參數(shù)資料
| 型號： | UPD7720AC |
| 廠商： | NEC Corp. |
| 英文描述： | QUARTERLY MICROPROCESSOR/MICROCOMPUTER RELIABILITY REPORT |
| 中文描述： | 季報微處理器/微機可靠性報告 |
| 文件頁數(shù)： | 7/12頁 |
| 文件大小： | 59K |
| 代理商： | UPD7720AC |
NEC Electronics Inc.
Roseville Manufacturing
7
Table 3. HTB Life Test Summary and Failure Rate Predictions (continued)
Process Type
Process Period
Ambient
Temp.
Number
of
Devices
532
Accum,.
Device
Hours
532,000
No. of
Failures
Accel.
Factor
(Note 1)
11.3
Equiv.
Device
Hours
6.01 x 106
Failure Rate, 55
°
C
and 60% Confidence
Level (Note 2)
μ
PD70335
(84-pin PLCC)
CMOS-5
Total
μ
PD78352
(64-pin LQFP)
CMOS-8
Total
Jan 94- Mar 99
(cumulative)
Apr 88– Mar 99
(cumulative)
Oct 94– Mar 99
(cumulative)
Oct 94– Mar 99
(cumulative)
(125
°
C)
0
(125
°
C)
3368
3,356,000
1
11.3
3.79 x 107
0.0053%/1000H
= 53FIT
(125
°
C)
192
192,000
0
_
_
(125
°
C)
192
192,000
0
_
_
Note 3
Notes
:
1. The acceleration factor was calculated using the Arrhenius mathematical model.
2. FIT was derived from HTB data for all available time periods.
3. Some of the above FIT rates were not calculated. Due to small sample sizes in these cases, the FIT rates would not be
meaningful. NEC expects a FIT rate of less than 100 for micro device types (target not to exceed 150).
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