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參數(shù)資料
| 型號： | UPG2150T5L |
| 廠商： | California Eastern Laboratories |
| 英文描述： | GaAs INTEGRATED CIRCUIT |
| 中文描述： | 砷化鎵集成電路 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 1162K |
| 代理商： | UPG2150T5L |
UPG2150T5L
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
n
d
S
o
h
M
n
d
S
b
m
y
S
o
n
o
C
n
o
n
o
C
Infrared Reflow
Peak temperature (package surface temperature)
p
m
e
a
e
p
m
i
Time at temperature of 220
°
C or higher
Preheating time at 120 to 180
°
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260
°
C or below
o
c
e
s
1
: 60 seconds or less
0
2
1
±
30 seconds
: 3 times
: 0.2%(Wt.) or below
s
e
d
n
C
IR260
5
1
2
: 25 to 40 seconds
s
6
3
: 3 times
: 0.2%(Wt.) or below
p
m
e
c
a
s
g
a
k
c
a
p
p
m
e
a
e
P
Time at temperature of 200
°
C or higher
Preheating time at 120 to 150
°
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
S
P
V
°
C or below
d
n
o
c
e
C
VP215
Wave Soldering
Peak temperature (molten solder temperature)
p
m
e
a
e
p
m
i
Preheating temperature (package surface temperature) : 120
°
C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 260
°
C or below
o
c
e
s
1
s
e
d
n
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350
°
C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
PRELIMINARY DATA SHEET
6
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| UPG2150T5L_07 | 制造商:CEL 制造商全稱:CEL 功能描述:SP3T SWITCH FOR BluetoothTM AND 802.11b/g |
| UPG2150T5L-A | 功能描述:RF 開關(guān) IC Bluetooth SP3T RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| UPG2150T5L-E2 | 制造商:NEC 制造商全稱:NEC 功能描述:SP3T SWITCH FOR BluetoothTM AND 802.11b/g |
| UPG2150T5L-E2-A | 功能描述:RF 開關(guān) IC Bluetooth SP3T RoHS:否 制造商:M/A-COM Technology Solutions 開關(guān)數(shù)量:Single 開關(guān)配置:SPDT 介入損耗:0.6 dB 截止隔離（典型值）:43 dB 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:PQFN-16 封裝:Reel |
| UPG2150T5L-EVAL-A | 功能描述:藍牙/802.15.1 開發(fā)工具 Bluetooth SP3T RoHS:否 制造商:Panasonic Electronic Components 產(chǎn)品:Bluetooth Evaluation Kit 工具用于評估:PAN1721 頻率:2.4 GHz 接口類型:I2C 工作電源電壓:2 V to 3.6 V |
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