參數(shù)資料
型號(hào): V23833-F0005-B102
廠商: INFINEON TECHNOLOGIES AG
英文描述: XFP850 nm Small Form Factor Module 10 Gigabit Pluggable Transceiver Compatible with XFP MSA Rev. 3.1
中文描述: XFP850納米纖巧萬(wàn)兆模塊可插拔收發(fā)器帶有XFP海事牧師3.1兼容
文件頁(yè)數(shù): 8/26頁(yè)
文件大小: 724K
代理商: V23833-F0005-B102
V23833-F0005-B101
V23833-F0005-B102
Description
Preliminary Product Information
8
2004-06-16
Electrical Interface Standard Specifications
IEEE 802.3ae-2002 clause 45 & 47
XFP MSA Rev. 3.1
Environment: Thermal Management Recommendations
Module can withstand and operate within specification with case temperature of 75°C for
up to 96 hrs/yr. Transceiver requires airflow parallel to cooling fins. Maximum airflow
required per XFP MSA is 3 m/s.
Fibers and Connectors
The transceiver LC features a duplex receptacle and is designed for multimode LC
cables, 0° polished end face (PC).
30-pin Connector
The module interface connector is a 30-pin, printed circuit board edge connection with a
0.8 mm pitch. The appropriate mating connector for the customer PCB is a 30-pin SMT,
dual row, right angled, edge connector, 0.8 mm pitch (TycoAmp part number 788862C
or equivalent).
Cage/Heatsink Requirement
The cage/heatsink assembly required to mount the XFP module is defined by the MSA.
Operating air inlet temperature:
Operating Airflow:
Operating Humidity:
Maximum operating case temperature is 70°C as defined by UL 1950.
0°C - 50°C
200 LFM (1.5 m/s)
80% RH non-condensing
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