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參數(shù)資料
| 型號(hào)： | V23839-R35-L55 |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 英文描述： | DEK9P |
| 中文描述： | iSFF -智能纖巧1.25千兆以太網(wǎng)4.25/2.125/1.0625 Gbit / s的連接器與立法會(huì)⑩多模光纖通道收發(fā)器為850 nm |
| 文件頁數(shù)： | 20/34頁 |
| 文件大?。?/td> | 636K |
| 代理商： | V23839-R35-L55 |
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V23839-R3x-L55
Application Notes
Preliminary Product Information
20
2004-06-25
EMI Recommendations
To avoid electromagnetic radiation exceeding the required limits set by the standards,
please take note of the following recommendations.
When Gigabit switching components are found on a PCB (e.g. multiplexer,
serializer-deserializer, clock data recovery, etc.), any opening of the chassis may leak
radiation; this may also occur at chassis slots other than that of the device itself. Thus
every mechanical opening or aperture should be as small as feasible and its length
carefully considered.
On the board itself, every data connection should be an impedance matched line (e.g.
strip line or coplanar strip line). Data (D) and Data-not (Dn) should be routed
symmetrically. Vias should be avoided. Where internal termination inside an IC or a
transceiver is not present, a line terminating resistor must be provided. The decision of
how best to establish a ground depends on many boundary conditions. This decision
may turn out to be critical for achieving lowest EMI performance. At RF frequencies the
ground plane will always carry some amount of RF noise. Thus the ground and
V
CC
planes are often major radiators inside an enclosure. As a general rule, for small systems
such as PCI cards placed inside poorly shielded enclosures, the common ground
scheme has often proven to be most effective in reducing RF emissions. In a common
ground scheme, the PCI card becomes more equipotential with the chassis ground. As
a result, the overall radiation will decrease. In a common ground scheme, it is strongly
recommended to provide a proper contact between signal ground and chassis ground at
every location where possible. This concept is designed to avoid hotspots which are
places of highest radiation, caused when only a few connections between chassis and
signal grounds exist. Compensation currents would concentrate at these connections,
causing radiation. However, as signal ground may be the main cause for parasitic
radiation, connecting chassis ground and signal ground at the wrong place may result in
enhanced RF emissions.
For example, connecting chassis ground and signal ground at a front
panel/bezel/chassis by means of a fiber optic transceiver may result in a large amount
of radiation especially where combined with an inadequate number of grounding points
between signal ground and chassis ground. Thus the transceiver becomes a single
contact point increasing radiation emissions. Even a capacitive coupling between signal
ground and chassis ground may be harmful if it is too close to an opening or an aperture.
For a number of systems, enforcing a strict separation of signal ground from chassis
ground may be advantageous, providing the housing does not present any slots or other
discontinuities. This separate ground concept seems to be more suitable in large
systems where appropriate shielding measures have also been implemented.
In many situations the question on which ground concept to implement in the design
cannot be easily decided prior to the receipt of first EMI measurement results. Infineon
thus offers both module versions; V23839-Xx5-Xxx for common ground and
V23839-Xx6-Xxx for separate ground concept.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| V23839-R36-L55 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:iSFF - Intelligent Small Form Factor 1.25 Gigabit Ethernet 4.25/2.125/1.0625 Gbit/s Fibre Channel Multimode 850 nm Transceiver with LCa?￠ Connector |
| V23848-C18-C56 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:iSFP-Intelligent Small Form-factor Pluggable SONET OC-3 IR-1 / SDH STM S-1.1 Multirate Applications up to 155 Mbit/s |
| V23848-C19-C56 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:iSFP-Intelligent Small Form-factor Pluggable SONET OC-3 IR-1 / SDH STM S-1.1 Multirate Applications up to 155 Mbit/s |
| V23848-H18-C56 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:iSFP-Intelligent Small Form-factor Pluggable SONET OC-12/OC-3 IR-1 / SDH STM S-4.1/S-1.1 Multirate Applications up to 622 Mbit/s |
| V23848-H19-C56 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:iSFP-Intelligent Small Form-factor Pluggable SONET OC-12/OC-3 IR-1 / SDH STM S-4.1/S-1.1 Multirate Applications up to 622 Mbit/s |
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