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參數(shù)資料
| 型號(hào)： | V24C48H400B3 |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 400 W DC-DC REG PWR SUPPLY MODULE |
| 文件頁數(shù)： | 4/13頁 |
| 文件大?。?/td> | 501K |
| 代理商： | V24C48H400B3 |
Vicor Corp. Tel: 800-735-6200, 978-470-2900 Fax: 978-475-6715
24V Maxi Family
Rev. 3.8
Page 12 of 13
Set your site on VICOR at www.vicorpower.com
1.74
44,2
2.20
55,9
5
6
7
8
9
4
3
2
1
0.23
5,8
(REF)
0.180
4,57
0.080
2,03
1.400
35,56
1.000
25,40
0.700
17,78
0.400
10,16
DIA,(7X)
DIA,(2X)
style 2 & 3
baseplates only
(4X)***
Slotted
or
Threaded
4-40 UNC-2B (6X)
or
Thru Hole
#30 Drill Thru (6X)
(0.1285)
0.50
12,7
0.06
1,5
2.20
55,9
(REF)
1.80
45,7
4.60
116,8
3.60
91,4
0.13
3,3
FULL R (6X)
(6X)
R
(3X)
CHAMFER
0.15
3,81
X 45
°
0.54
13,7
0.43
10,9
0.38
9,6
0.20**
5,08
0.12*
3,1
(2X)
0.01
Use a
4-40 Screw (6x)
Torque to:
5 in-lbs
0.57 N-m
Long Pin
0.62
15,7
Short Pin
(9X)
(ALL
MARKINGS
THIS
SURF
A
CE)
ALUMINUM
BASEPLATE
0.50
±0.02
12,7
±0,5
* Slotted baseplate only
** Threaded & thru-hole (style 2 & 3) baseplates
*** Reserved for Vicor accessories. Not for mounting
Center line
4.200
106,68
0.300
±0.015
7,62
±0,38
0.300
±0.015
7,62
±0,38
2.00
50,8
0.10
2,5
Pin CL
C
L
ALL MARKINGS
THIS SURFACE
PINS STYLES
SOLDER:TIN/LEAD
HOT SOLDER DIPPED
MODUMATE: GOLD PLATED COPPER
RoHS: GOLD PLATED COPPER
ALUMINUM
BASEPLATE
Unless otherwise specified,
dimensions are in inches
mm
Decimals
Tol.
Angles
0.XX
±0.01
±0,25
±1°
0.XXX
±0.005
±0,127
0.195
4,95
1.400*
35,56
1.000*
25,40
0.700*
17,78
0.400*
10,16
3.844**
97,64
4.200*
106,68
1.790**
45,47
0.06
1,5
R
(4X)
0.178
4,52
5
6
7
8
9
12
34
±0.003
±0,08
* DENOTES TOL =
PLATED
THRU HOLE
DIA
PCB THICKNESS
0.062
±0.010
1,57
±0,25
SHORT PIN STYLE
0.094
±0.003
2,39
±0,08
0.194
±0.003
4,93
±0,08
LONG PIN STYLE
0.094
±0.003
2,39
±0,08
0.194
±0.003
4,93
±0,08
INBOARD
SOLDER
MOUNT
0.43
10,9
ONBOARD
SOLDER
MOUNT
(7X)
(2X)
0.53
13,5
**PCB WINDOW
Converter Pins
No.
Function
Label
1
+In
+
2
Primary
PC
Control
3
Parallel
PR
4
–In
–
5–Out
–
6
–Sense
–S
7
Secondary
SC
Control
8
+Sense
+S
9
+Out
+
Consult Vicor Application Note:
SOLDERING METHODS AND PROCEDURES FOR
VI-200/VI-J00 & MAXI, MINI AND MICRO MODULES
MECHANICAL DRAWINGS
Figure 13 — Module outline
Figure 14 — PCB mounting specifications
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