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參數(shù)資料
| 型號(hào)： | V5.5MLN40805 |
| 廠商： | Littelfuse, Inc. |
| 英文描述： | MLN SurgeArray⑩ Suppressor |
| 中文描述： | 腸系膜淋巴結(jié)SurgeArray⑩抑制器 |
| 文件頁(yè)數(shù)： | 5/7頁(yè) |
| 文件大?。?/td> | 1177K |
| 代理商： | V5.5MLN40805 |
184
www.littelfuse.com
Multiline Transient Voltage Surge Suppressor
MLN SurgeArray
Suppressor
RoHS
Soldering Recommendations
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are IR Re-flow & Wave soldering.Typical profiles are
shown in Figures 14 & 15
The recommended solder for the MLN SurgeArray suppressor is a
62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also rec-
ommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled.
When using a reflow process, care should be taken to ensure that the
MLN chip is not subjected to a thermal gradient steeper than 4 degrees
per second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solderís peak
temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is still necessary to
ensure that any further thermal shocks are avoided. One possible cause
of thermal shock is hot printed circuit boards being removed from the
solder process and subjected to cleaning solvents at room temperature.
The boards must be allowed to cool gradually to less than 50C before
cleaning.
Lead-Free (Pb-free) Soldering Recommendations
Littelfuse offers the 0805 array as the preferred solution for lead-free sol-
dering conditions.
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but
there is a wide selection of pastes & fluxes available with which the nick-
el barrier parts should be compatible.
The reflow profile must be constrained by maximums shown in Figure16.
For Pb-free Wave soldering, Figure 15 still applies.
Note: the Pb-free paste, flux & profile were used for evaluation purposes
by Littelfuse, based upon industry standards & practices.There are
multiple choices of all three available, it is advised that the customer
explores the optimum combination for their process as processes vary
considerably from site to site.
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15. WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
T
o
C
TIME (MINUTES)
300
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260
o
C
SECOND PREHEAT
FIRST PREHEAT
5.0 6.0 7.0
20 - 40 SECONDS WITHIN 5C
RAMP RATE
PREHEAT ZONE
<3C/s
<3C/s
60 > 217C
> 217C
230
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15. WAVE SOLDER PROFILE
FIGURE 16. LEAD-FREE RE-FLOW SOLDER PROFILE
T
o
C
TI2.0
300
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260
o
C
SECOND PREHEAT
FIRST PREHEAT
5.0 6.0 7.0
MAXIMUM TEMPERATURE 260C
MAXIMUM TEMPERATURE 260C
PREHEAT ZONE
60 - 150 SEC
230
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