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參數(shù)資料
| 型號： | V68MLA1206 |
| 廠商： | Littelfuse, Inc. |
| 英文描述： | Multilayer Transient Voltage Surge Suppressors |
| 中文描述： | 多層瞬態(tài)電壓浪涌抑制器 |
| 文件頁數(shù)： | 8/11頁 |
| 文件大?。?/td> | 254K |
| 代理商： | V68MLA1206 |
Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) re-flow, vapour phase re-flow and wave
soldering.Typical profiles are shown in Figures 14, 15 and 16.When wave
soldering, the ML suppressor is attached to the circuit board by means of an
adhesive.The assembly is then placed on a conveyor and run through the
soldering process to contact the wave.With IR and vapour phase reflow; the
device is placed in a solder paste on the substrate. As the solder paste is
heated, it re-flows and solders the unit to the board.
The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag),
60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA
solder flux.
Wave soldering is the most strenuous of the processes.To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402 size devices, IR
re-flow is recommended.
When using a reflow process, care should be taken to ensure that the ML
chip is not subjected to a thermal gradient steeper than 4 degrees per
second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solder
’
s peak
temperature is essential to minimize thermal shock. Examples of the
soldering conditions for the ML suppressor are given in the tables below.
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature.The boards must be allowed to cool gradually to less than
50
o
C before cleaning.
Termination Options
Littelfuse offers three types of electrode termination finish for the
Multilayer product series:
1. Silver/Platinum (standard, not available for 0402)
2. Silver/Palladium (optional)
(The ordering information section describes how to designate them.)
3. Nickel Barrier (optional for 0402-1210 package size)
(The ordering information section describes how to designate them.)
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15. WAVE SOLDER PROFILE
FIGURE 16. VAPOR PHASE SOLDER PROFILE
T
o
C
TIME (MINUTES)
300
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260
o
C
SECOND PREHEAT
FIRST PREHEAT
T
o
C
TIME (MINUTES)
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
RAMP RATE
>50
C/s
PREHEAT ZONE
MAXIMUM
TEMPERATURE 222
o
C
40-80
SECONDS
ABOVE 183
o
C
T
o
C
TIME (MINUTES)
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
MAXIMUM
PREHEAT DWELL
PREHEAT ZONE
TEMPERATURE 222
C
RAMP RATE
<2
C/s
40-80
SECONDS
ABOVE 183
o
C
ML Varistor Series
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
147
www.littelfuse.com
3
S
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| V68MLA1206A | 功能描述:壓敏電阻 68V 180A 100pF RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
| V68MLA1206H | 功能描述:壓敏電阻 68V 180A 100pF RoHS:否 制造商:EPCOS 產(chǎn)品:MLV 電壓額定值 DC:22 V 電壓額定值 AC:17 V 鉗位電壓:50 V 直徑: 峰值浪涌電流:30 A 浪涌能量額定值:75 mJ 電容:74.2 pF 工作溫度范圍:- 55 C to + 125 C 安裝:SMD/SMT 封裝:Reel |
| V68MLA1206H | 制造商:Littelfuse 功能描述:VARISTOR 1206 68VA |
| V68MLA1206H | 制造商:Littelfuse 功能描述:Metal Oxide Varistor (MOV) |
| V68MLA1206N | 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Surface Mount Multilayer Varistors |
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