參數(shù)資料
型號(hào): VC-709-PCIE2-100M000000
廠商: VECTRON INTERNATIONAL
元件分類: XO, clock
英文描述: CRYSTAL OSCILLATOR, CLOCK, 100 MHz, HSCL OUTPUT
封裝: ROHS COMPLIANT, HERMETIC SEALED, CERAMIC PACKAGE-6
文件頁數(shù): 4/5頁
文件大?。?/td> 325K
代理商: VC-709-PCIE2-100M000000
Vectron International 267 Lowell Road, Hudson, NH 03051 Tel: 1-88-VECTRON-1 http://www.vectron.com
Page4
Table 4. Reflow Profile
Parameter
PreHeat Time
Ramp Up
Time above 217°C
Time to Peak Temperature
Time at 260°C
Time at 240°C
Ramp down
Symbol
ts
R
UP
tL
tAMB-P
tP
tP2
R
DN
Value
200 sec Max
3°C/sec Max
150 sec Max
480 sec Max
30 sec Max
60 sec Max
6°C/sec Max
Suggested IR Profile
Devices are built using lead free epoxy and can be subjected to
standard lead free IR reflow conditions shown in Table 5. Contact
pads are gold over nickel and lower maximum temperatures can also
be used, such as 220C.
S
IR Compliance
Absolute Maximum Ratings and Handling Precautions
Stresses in excess of the absolute maximum ratings can permanently damage the device. Functional operation is not implied or any other
excess of conditions represented in the operational sections of this data sheet. Exposure to absolute maximum ratings for extended
periods may adversely affect device reliability.
Although ESD protection circuitry has been designed into the VC-709, proper precautions should be taken when handling and mounting,
VI employs a Human Body Model and Charged Device Model for ESD susceptibility testing and design evaluation.
ESD thresholds are dependent on the circuit parameters used to define the model. Although no industry standard has been adopted for
the CDM a standard resistance of 1.5kOhms and capacitance of 100pF is widely used and therefor can be used for comparison purposes.
S
Table 5. Maximum Ratings
Parameter
Storage Temperature
Supply Voltage
Enable Disable Voltage
Symbol
T
STORE
-0.5 to 5.0
-0.5 to V
DD
+0.5
1500
1500
Unit
°C
V
V
ESD, Human Body Model
ESD, Charged Device Model
V
V
Maximum Ratings, Tape & Reel
Environmental and IR Compliance
Table 3. Environmental Compliance
Parameter
Mechanical Shock
Mechanical Vibration
Temperature Cycle
Solderability
Fine and Gross Leak
Resistance to Solvents
Moisture Sensitivity Level
Contact Pads
Condition
MIL-STD-883 Method 2002
MIL-STD-883 Method 2007
MIL-STD-883 Method 1010
MIL-STD-883 Method 2003
MIL-STD-883 Method 1014
MIL-STD-883 Method 2015
MSL1
Gold over Nickel
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