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參數(shù)資料
| 型號(hào)： | VCA610UA |
| 英文描述： | WIDEBAND VOLTAGE CONTROLLED AMPLIFIER |
| 中文描述： | 寬帶電壓控制放大器 |
| 文件頁(yè)數(shù)： | 3/12頁(yè) |
| 文件大?。?/td> | 212K |
| 代理商： | VCA610UA |
VCA610
3
PIN CONFIGURATION
Top View
DIP
SO-8
–V
S
7
+V
S
6
–In
8
V
OUT
5
VCA610
2
GND
3
1
+In
4
Gain
Control,
V
C
No
Internal
Connection
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
ABSOLUTE MAXIMUM RATINGS
Supply .................................................................................................
±
7V
Differential Input Voltage............................................................... Total V
S
Input Voltage Range .....................................See Input Protection Section
Storage Temperature Range .......................................... –65
°
C to +150
°
C
Lead Temperature (soldering, DIP, 10s)........................................ +300
°
C
Lead Temperature (soldering, SO-8, 3s) ....................................... +260
°
C
Output Short-Circuit to Ground (+25
°
C) ................................... Continuous
Junction Temperature (T
J
) ............................................................. +175
°
C
PACKAGE/ORDERING INFORMATION
PACKAGE DRAWING
NUMBER
(1)
PRODUCT
PACKAGE
VCA610PA
VCA610P
VCA610UA
VCA610U
8-Pin Plastic DIP
8-Pin Plastic DIP
SO-8 Surface-Mount
SO-8 Surface-Mount
006
006
182
182
NOTE:(1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
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