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參數(shù)資料
| 型號： | VS-505-LFF-HBBN-200M000000 |
| 廠商： | VECTRON INTERNATIONAL |
| 元件分類： | XO, clock |
| 英文描述： | VOLTAGE CONTROLLED CLOCK SAW OSCILLATOR, 200 MHz |
| 封裝： | ROHS COMPLIANT, HERMETIC SEALED, LEADLESS PACKAGE-6 |
| 文件頁數(shù)： | 6/9頁 |
| 文件大?。?/td> | 0K |
| 代理商： | VS-505-LFF-HBBN-200M000000 |
VS-505 Single Frequency VCSO
Vectron International, 267 Lowell Road, Hudson, NH 03051
Tel: 1-88-VECTRON-1
Web: www.vectron.com
Page 6 of 9
Rev: 05Nov2008
25
217
200
150
260
Temperature
(DegC)
Time (sec)
t S
t AMB-P
t L
t P
R UP
R DN
Reliability
VI qualification includes aging at various extreme temperatures, shock and vibration, temperature cycling, and
IR reflow simulation. The VS-505 family is capable of meeting the following qualification tests:
Environmental Compliance
Parameter
Conditions
Mechanical Shock
MIL-STD-883, Method 2002
Mechanical Vibration
MIL-STD-883, Method 2007
Solderability
MIL-STD-883, Method 2003
Gross and Fine Leak
MIL-STD-883, Method 1014
Resistance to Solvents
MIL-STD-883, Method 2016
Moisture Sensitivity Level
IPC/JEDEC J-STD-020, MSL1
Handling Precautions
Although ESD protection circuitry has been designed into the VS-505 proper precautions should be taken when
handling and mounting. VI employs a human body model (HBM) and a charged-device model (CDM) for ESD
susceptibility testing and design protection evaluation.
ESD Ratings
Model
Minimum
Conditions
Human Body Model
2000 V
MIL-STD 883, Method 3015
Charged Device Model
1000 V
JEDEC, JESD22-C101
Machine Model
200 V
JEDEC, JESD22-A115-A
Reflow Profile (IPC/JEDEC J-STD-020)
Parameter
Symbol
Value
PreHeat Time
t S
60 sec Min, 180 sec Max
Ramp Up
R UP
3
oC/sec Max
Time Above 217
oC
t L
60 sec Min, 150 sec Max
Time To Peak Temperature
t AMB-P
480 sec Max
Time At 260
oC
t P
20 sec Min, 40 sec Max
Ramp Down
R DN
6
oC/sec Max
The VS-505 is qualified to meet the JEDEC standard
for Pb-Free assembly. The temperatures and time
intervals listed are based on the Pb-Free small body
requirements. The temperatures refer to the topside
of the package, measured on the package body
surface. The VS-505 should not be subjected to a
wash process that will immerse it in solvents. NO
CLEAN is the recommended procedure. The VS-505
has been designed for pick and place reflow soldering.
The VS-505 may be reflowed once and should not be
reflowed in the inverted position.
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