參數(shù)資料
型號(hào): VSC7939W
廠商: VITESSE SEMICONDUCTOR CORP
元件分類: 其它接口
英文描述: Laser Diode Driver with Automatic Power Control
中文描述: SPECIALTY INTERFACE CIRCUIT, UUC48
封裝: DIE-48
文件頁(yè)數(shù): 5/18頁(yè)
文件大?。?/td> 226K
代理商: VSC7939W
VITESSE
Preliminary Data Sheet
VSC7939
SONET/SDH 3.125Gb/s
Laser Diode Driver with Automatic Power Control
G52350-0, Rev 3.2
02/26/01
Page 5
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano
Camarillo, CA 93012
Tel: (800) VITESSE
FAX: (805) 987-5896
Email: prodinfo@vitesse.com
Internet: www.vitesse.com
Bare Die Pad Descriptions
Figure 1: Pad Assignments
VSC7939
Pad 10
CLK-
Pad 9
CLK+
Pad 8
VCC1
Pad 7
GND1
Pad 6
VCC1
Pad 5
DATA-
Pad 4
DATA+
Pad 3
VCC1
Pad 2
GND1
Pad 1
GND2
Pad 48
VCC2
Pad 47
BIASMAX
20
μm
(0.0008")
1773
μm (0.0698")
(Pin 1)
(Pin 2)
(Pin 3)
(Pin 4)
(Pin 5)
(Pin 6)
(Pin 18)
(Pin 19)
(Pin 20)
(Pin 21)
(Pin 22)
(Pin 23)
(Pin 24)
(Pin 25)
(Pin 26)
(Pin 27)
(Pin 28)
(Pin 29)
(Pin 31)
(Pin 30)
(Pin 32)
(Pin 7)
(Pin 8)
(Pin 9)
(Pin 10)
(Pin 11)
(Pin 12)
(Pin 13)
(Pin 14)
(Pin 15)
(Pin 16)
(Pin 17)
Pad 46
MODSET
Pad 45
GND2
Pad 44
APCSET
Pad 43
RESERVED
Pad 42
GND3
Pad 41
PB_GND
Pad 40
GND3
Pad 39
PB_GND
Pad 38
CAPC
Pad 37
VCC3
Pad 36
GND3
Pad 12
GND1
Pad 13
LATCH
Pad 14
ENABLE
Pad 15
DISABLE
Pad 16
GND1
Pad 17
BIASMON
Pad 18
MODMON
Pad 19
FAIL
Pad 20
GND4
Pad 21
PB_GND
Pad 22
APCFILT
Pad 23
GND4
Pad 24
VCC4
Pad 25
BIAS
Pad 11
VCC1
Pad 27
VCC4
Pad 28
DB_OUT+
Pad 29
OUT+
Pad 30
OUT-
Pad 31
DB_OUT-
Pad 32
VCC4
Pad 33
GND4
Pad 34
GND3
Pad 35
MD
Pad 26
PB_GND1
Die Size:
Die Thickness:
Pad Pitch:
Pad Size:
Pad to Pad Clearance:
Pad Passivation Opening:
95μm x 95μm (0.0037
"
x 0.0037
"
)
Scribe Size:
75μm (0.0030
"
)
1773μm x 2233μm (0.0698" x 0.0879")
625
μm (0.0246
"
)
115
μm (0.0045
"
)
95μm x 95μm (0.0037
"
x 0.0037
"
)
20μm (0.0008
"
)
2233
μm
(0.0879")
75
μm
(0.0030")
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