參數(shù)資料
型號(hào): W25Q32BVDAAP
廠商: WINBOND ELECTRONICS CORP
元件分類(lèi): PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDIP8
封裝: 0.300 INCH, GREEN, PLASTIC, DIP-8
文件頁(yè)數(shù): 10/79頁(yè)
文件大?。?/td> 1090K
代理商: W25Q32BVDAAP
W25Q32BV
- 18 -
7.1.12 Status Register Memory Protection (CMP = 1)
STATUS REGISTER(1)
W25Q32BV (32M-BIT) MEMORY PROTECTION(3)
SEC
TB
BP2
BP1
BP0
PROTECTED
BLOCK(S)
PROTECTED
ADDRESSES
PROTECTED
DENSITY
PROTECTED
PORTION(2)
X
0
0 thru 63
000000h – 3FFFFFh
4MB
ALL
0
1
0 thru 62
000000h – 3EFFFFh
4,032KB
Lower 63/64
0
1
0
0 and 61
000000h – 3DFFFFh
3,968KB
Lower 31/32
0
1
0 thru 59
000000h – 3BFFFFh
3,840KB
Lower 15/16
0
1
0
0 thru 55
000000h – 37FFFFh
3,584KB
Lower 7/8
0
1
0
1
0 thru 47
000000h – 2FFFFFh
3MB
Lower 3/4
0
1
0
0 thru 31
000000h – 1FFFFFh
2MB
Lower 1/2
0
1
0
1
1 thru 63
010000h – 3FFFFFh
4,032KB
Upper 63/64
0
1
0
1
0
2 and 63
020000h – 3FFFFFh
3,968KB
Upper 31/32
0
1
0
1
4 thru 63
040000h – 3FFFFFh
3,840KB
Upper 15/16
0
1
0
8 thru 63
080000h – 3FFFFFh
3,584KB
Upper 7/8
0
1
0
1
16 thru 63
100000h – 3FFFFFh
3MB
Upper 3/4
0
1
0
32 thru 63
200000h – 3FFFFFh
2MB
Upper 1/2
X
1
NONE
1
0
1
0 thru 63
000000h – 3FEFFFh
4,092KB
L - 1023/1024
1
0
1
0
0 thru 63
000000h – 3FDFFFh
4,088KB
L - 511/512
1
0
1
0 thru 63
000000h – 3FBFFFh
4,080KB
L - 255/256
1
0
1
0
X
0 thru 63
000000h – 3F7FFFh
4,064KB
L - 127/128
1
0
1
0 thru 63
001000h – 3FFFFFh
4,092KB
U - 1023/1024
1
0
1
0
0 thru 63
002000h – 3FFFFFh
4,088KB
U - 511/512
1
0
1
0 thru 63
004000h – 3FFFFFh
4,080KB
U - 255/256
1
0
X
0 thru 63
008000h – 3FFFFFh
4,064KB
U - 127/128
Notes:
1. X = don’t care
2. L = Lower; U = Upper
3. If any Erase or Program command specifies a memory region that contains protected data portion, this
command will be ignored.
相關(guān)PDF資料
PDF描述
W25Q32BVDAIG 32M X 1 SPI BUS SERIAL EEPROM, PDIP8
W25Q32BVSFIG 32M X 1 SPI BUS SERIAL EEPROM, PDSO16
W3EG6466S335BD4S 64M X 64 DDR DRAM MODULE, 0.7 ns, DMA200
WEDF1M32B-70G2UC5A 1M X 32 FLASH 5V PROM MODULE, 70 ns, CQFP68
WE128K32P-140G2TI 128K X 32 EEPROM 5V MODULE, 125 ns, CQFP68
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q32BVDAIG 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVDAIP 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFAG 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFAP 制造商:WINBOND 制造商全稱(chēng):Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSFIG 功能描述:IC SPI FLASH 32MBIT 16SOIC RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線(xiàn)串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)