參數(shù)資料
型號(hào): W25Q32BVSFIG
廠商: WINBOND ELECTRONICS CORP
元件分類(lèi): PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDSO16
封裝: 0.300 INCH, GREEN, SOIC-16
文件頁(yè)數(shù): 52/79頁(yè)
文件大小: 1090K
代理商: W25Q32BVSFIG
W25Q32BV
- 56 -
7.2.35 Read JEDEC ID (9Fh)
For compatibility reasons, the W25Q32BV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low
and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and
two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling
edge of CLK with most significant bit (MSB) first as shown in Figure 33. For memory type and capacity
values refer to Manufacturer and Device Identification table.
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (9Fh)
High Impedance
8
9
10
12
13
14
15
Capacity ID7-0
/CS
CLK
DI
(IO
0)
DO
16
(IO
1)
17
18
19
20
21
22
23
Manufacturer ID (EFh)
24
25
26
28
29
30
7
6
5
4
3
2
1
0
27
15
*
Mode 0
Mode 3
11
7
6
5
4
3
2
1
0
*
Memory Type ID15-8
= MSB
*
Figure 33. Read JEDEC ID Instruction Sequence
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