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參數(shù)資料
| 型號(hào)： | W3DG6318V75D2MG |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 16M X 64 SYNCHRONOUS DRAM MODULE, DMA168 |
| 封裝： | ROHS COMPLIANT, DIMM-168 |
| 文件頁(yè)數(shù)： | 5/7頁(yè) |
| 文件大小： | 143K |
| 代理商： | W3DG6318V75D2MG |
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3DG6418V-D2
March 2006
Rev. 1
PRELIMINARY
ORDERING INFORMATION
Part Number
Clock Speed
CAS Latency
Height*
W3DG6418V10D2xx
100MHz
CL=2
30.48 (1.20")
W3DG6418V7D2xx
133MHz
CL=2
30.48 (1.20")
W3DG6418V75D2xx
133MHz
CL=3
30.48 (1.20")
PACKAGE DIMENSIONS
Part Number
Clock Speed
CAS Latency
Height*
W3DG6318V10D2xx
100MHz
CL=2
30.48 (1.20")
W3DG6318V7D2xx
133MHz
CL=2
30.48 (1.20")
W3DG6318V75D2xx
133MHz
CL=3
30.48 (1.20")
Note: WP (write protect) is available on pin 81.
3.99
(0.157)
(2X)
8.89
(0.350)
6.35
(0.250)
P1
11.43
(0.450)
3.18
(0.125) (2X)
133.48
(5.255 MAX.)
115.57
(4.550)
6.35
(0.250)
54.61
(2.150)
1.27 ± 0.10
(0.050 ± 0.004)
3.99
(0.157)
MIN.
3.05
(0.120)
MAX.
30.48
(1.200)
MAX.
17.78
(0.700)
42.16
(1.660)
36.83
(1.450)
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES).
Ordering Information
Clock Speed
CAS Latency
Height*
W3DG6418V10D2I-xx
100MHz
CL=2
30.48 (1.20")
W3DG6418V7D2I-xx
133MHz
CL=2
30.48 (1.20")
W3DG6418V75D2I-xx
133MHz
CL=3
30.48 (1.20")
INDUSTRIAL TEMPERATURE
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3DG6318V75D2XX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128MB - 16Mx64, SDRAM UNBUFFERED |
| W3DG6318V7D2XX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:128MB - 16Mx64, SDRAM UNBUFFERED |
| W3DG6334V10D2 | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 2x16Mx64 SDRAM UNBUFFERED |
| W3DG6334V75D2 | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 2x16Mx64 SDRAM UNBUFFERED |
| W3DG6334V7D2 | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:256MB - 2x16Mx64 SDRAM UNBUFFERED |
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