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參數(shù)資料
| 型號(hào)： | W3DG644V75D2 |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | DRAM |
| 英文描述： | 4M X 64 SYNCHRONOUS DRAM MODULE, DMA168 |
| 封裝： | DIMM-168 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 161K |
| 代理商： | W3DG644V75D2 |
July 2004
Rev 1
W3DG644V-D2
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PRELIMINARY
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
3.99
(0.157)
(2X)
8.89
(0.350)
P1
11.43
(0.450)
0.00 (0.125) (2X)
133.48 (5.255) MAX.
115.57 (4.550)
6.35 (0.250)
54.61 (2.150)
1.27 ± 0.10
(0.050 ± 0.0039)
3.99
(0.157)
MIN
3.81
(0.150)
MAX.
25.40
(1.000)
MAX
17.78
(0.700)
278
57.79 (2.275)
36.83 (1.450)
PACKAGE DIMENSIONS
ORDERING INFORMATION
Note: Modules are available in industrial temperature - 40°C
≤
TA ≤ 85°C.
Add an "I" to the end of the part number.
Part Number
Speed
CAS Latency
Height*
W3DG644V10D2
100MHz
CL=2
25.40 (1.00")
W3DG644V7D2
133MHz
CL=2
25.40 (1.00")
W3DG644V75D2
133MHz
CL=3
25.40 (1.00")
Part Number
Speed
CAS Latency
Height*
W3DG634V10D2
100MHz
CL=2
25.40 (1.00")
W3DG634V7D2
133MHz
CL=2
25.40 (1.00")
W3DG634V75D2
133MHz
CL=3
25.40 (1.00")
Note: Available with WP (write protect) on pin 81.
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PDF描述 |
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| W3EG6467S262D4MG | 64M X 64 DDR DRAM MODULE, 0.75 ns, DMA200 |
| W7NCF02GH10IS2DG | 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3DG644V7D2 | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32MB - 4M x 64 SDRAM UNBUFFERED |
| W3DG644V-D2 | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32MB - 4M x 64 SDRAM UNBUFFERED |
| W3DG6463V10D2-G | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 SDRAM UNBUFFERED |
| W3DG6463V10D2-GG | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 SDRAM UNBUFFERED |
| W3DG6463V10D2-M | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 SDRAM UNBUFFERED |
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