參數(shù)資料
型號: W3DG7268V75JD1
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 64M X 72 SYNCHRONOUS DRAM MODULE, 5.4 ns, ZMA144
封裝: SODIMM-144
文件頁數(shù): 9/10頁
文件大?。?/td> 241K
代理商: W3DG7268V75JD1
W3DG7268V-D1
-JD1
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
March 2005
Rev. 3
PRELIMINARY
PACKAGE DIMENSIONS FOR JD1
Ordering Information
Speed
CAS Latency
Height*
W3DG7268V10JD1
100MHz
CL=2
31.75 (1.25”) MAX
W3DG7268V7JD1
133MHz
CL=2
31.75 (1.25”) MAX
W3DG7268V75JD1
133MHz
CL=3
31.75 (1.25”) MAX
NOTES:
Consult Factory for availability of Lead-Free products. (F = Lead-Free, G = RoHS Compliant)
Vendor specic part numbers are used to provide memory components source control. The place holder for this is
shown as lower case “x” in the part numbers above and is to be replaced with the respective vendors code. Consult
factory for qualied sourcing options. (M = Micron, S = Samsung & consult factory for others)
Consult factory for availability of industrial temperature (-40°C to 85°C) option
3.99
(0.157)
2.01 (0.079 Min)
67.72
(2.661 Max)
WEDC
301
32.79
(1.291)
4.60 (0.181)
1.50 (0.059)
28.2
(1.112)
23.14
(0.913)
19.99
(0.787)
31.75
(1.25)
Max
3.81
(0.150)
MAX.
0.99
(0.039)
(± 0.004)
PACKAGE DIMENSIONS FOR JD1
* ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES).
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