參數(shù)資料
型號: W3EG7262S265D3S
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA184
封裝: DIMM-184
文件頁數(shù): 10/12頁
文件大?。?/td> 218K
代理商: W3EG7262S265D3S
W3EG7262S-D3
-JD3
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
May 2005
Rev. 3
PRELIMINARY
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND
RECOMMENDED AC OPERATING CONDITIONS
0°C ≤ TA ≤ +70°C; VCC = +2.5V ± 0.2V, VCCQ = +2.5V ± 0.2V
AC Characteristics
262
265, 202
Parameter
Symbol
Min
Max
Min
Max
Units
Notes
Access window of DQs from CK, CK#
tAC
-0.75
+0.75
-0.75
+0.75
ns
CK high-level width
tCH
0.45
0.55
0.45
0.55
tCK
16
CK low-level width
tCL
0.45
0.55
0.45
0.55
tCK
16
Clock cycle time
CL=2.5
tCK (2.5)
7.5
13
7.5
13
ns
22
CL=2
tCK (2)
7.5
13
10
13
ns
22
DQ and DM input hold time relative to DQS
tDH
0.5
ns
14,17
DQ and DM input setup time relative to DQS
tDS
0.5
ns
14,17
DQ and DM input pulse width (for each input)
tDIPW
1.75
ns
17
Access window of DQS from CK, CK#
tDQSCK
-0.75
+0.75
-0.75
+0.75
ns
DQS input high pulse width
tDQSH
0.35
tCK
DQS input low pulse width
tDQSL
0.35
tCK
DQS-DQ skew, DQS to last DQ valid, per group,
per access
tDQSQ
0.5
ns
13,14
Write command to rst DQS latching transition
tDQSS
0.75
1.25
0.75
1.25
tCK
DQS falling edge to CK rising - setup time
tDSS
0.2
tCK
DQS falling edge from CK rising - hold time
tDSH
0.2
tCK
Half clock period
tHP
tCH, tCL
ns
18
Data-out high-impedance window from CK, CK#
tHZ
+0.75
ns
8,19
Data-out low-impedance window from CK, CK#
tLZ
-0.75
ns
8,20
Address and control input hold time (fast slew rate)
tIHf
0.90
ns
6
Address and control input set-up time (fast slew rate)
tISf
0.90
ns
6
Address and control input hold time (slow slew rate)
tIHs
1
ns
6
Address and control input setup time (slow slew rate)
tISs
1
ns
6
Address and control input pulse width (for each input)
tIPW
2.2
ns
LOAD MODE REGISTER command cycle time
tMRD
15
ns
DQ-DQS hold, DQS to rst DQ to go non-valid, per access
tQH
tHP-tQHS
ns
13,14
Data hold skew factor
tQHS
0.75
ns
ACTIVE to PRECHARGE command
tRAS
45
120,000
45
120,000
ns
15
ACTIVE to READ with Auto precharge command
tRAP
20
ns
ACTIVE to ACTIVE/AUTO REFRESH command period
tRC
65
ns
AUTO REFRESH command period
tRFC
75
ns
21
相關(guān)PDF資料
PDF描述
W7NCF01GH21IS8DG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF01GH21ISAAG 64M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
WED3DG6316V10D2I 16M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WED3DG639V7D2I 8M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WED3DG7266V10D1I-MG 64M X 72 SYNCHRONOUS DRAM MODULE, ZMA144
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3EG7262S265JD3 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 2X32Mx72 DDR SDRAM UNBUFFERED
W3EG7262S-D3 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 2X32Mx72 DDR SDRAM UNBUFFERED
W3EG7262S-JD3 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB - 2X32Mx72 DDR SDRAM UNBUFFERED
W3EG7263S202AJD3 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB- 64Mx72 DDR SDRAM REGISTERED w/PLL
W3EG7263S202D3 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512MB- 64Mx72 DDR SDRAM REGISTERED w/PLL