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參數(shù)資料
| 型號： | W3H32M64E-533SBI |
| 英文描述： | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| 中文描述： | 32M的× 64 DDR2 SDRAM的208 PBGA封裝多芯片封裝 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 240K |
| 代理商： | W3H32M64E-533SBI |
W3H32M64E-XSBX
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
October 2005
Rev. 3
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
Document Title
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 0
Initial Release
June 2005
Advanced
Rev 1
Rev 2
Rev 3
Changes (Pg. 1, 3, 5)
1.1 Change max package width to 16mm
Changes (pg. 1, 3, 6)
2.1 Pinout added
Changes (Pg. 1, 3, 6)
3.1 Change all V
CCQ
to V
CC
August 2005
October 2005
October 2005
Advanced
Advanced
Advanced
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W3H32M64E-533SBM | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ES | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESI | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESM | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667SB | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M64E-533SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 533MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M64E-667ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667ESM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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