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參數(shù)資料
| 型號(hào)： | W3H32M64E-667ESM |
| 英文描述： | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| 中文描述： | 32M的× 64 DDR2 SDRAM的208 PBGA封裝多芯片封裝 |
| 文件頁(yè)數(shù)： | 4/6頁(yè) |
| 文件大?。?/td> | 240K |
| 代理商： | W3H32M64E-667ESM |
W3H32M64E-XSBX
4
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
October 2005
Rev. 3
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
All linear dimensions are millimeters and parenthetically in inches
BOTTOM VIEW
PACKAGE DIMENSION: 208 PLASTIC BALL GRID ARRAY (PBGA)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
11 10 9
8
7
6
5
4
3
2
1
208 x 0.60 (0.024) NOM
1.0 (0.039)NOM
10.0 (0.394) NOM
16.15 (0.636) MAX
2
1
1
2.56 (0.100) MAX
0.50
(0.020)
NOM
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W3H32M64E-667SB | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667SBC | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667SBI | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667SBM | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-ES | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M64E-667SB | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667SBC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA COMMERICAL TEMP. - Bulk |
| W3H32M64E-667SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Trays 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H32M64E-667SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M64EA-400SBM | 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
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