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參數(shù)資料
| 型號： | W3H32M64E-667SBC |
| 英文描述： | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| 中文描述： | 32M的× 64 DDR2 SDRAM的208 PBGA封裝多芯片封裝 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 240K |
| 代理商： | W3H32M64E-667SBC |
W3H32M64E-XSBX
5
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
October 2005
Rev. 3
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR2 SDRAM
CONFIGURATION, 32M x 64
1.8V Power Supply
DATA RATE (Mbs)
400 = 400Mbs
533 = 533Mbs
667 = 667Mbs
Blank = No datarate specified for ES product
(1)
PACKAGE:
ES = Non Qualified Product
(1)
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
I = In dus ri al
C = Com mer cial 0°C to +70°C
Blank = No temperature specified for ES product
(1)
-55°C to +125°C
-40°C to +85°C
W 3H 32M 64 E - XXX SB X
Note 1: W3H32M64E-ESSB is the only available product until completion of qualification.
相關PDF資料 |
PDF描述 |
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| W3H32M64E-667SBI | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-667SBM | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-ES | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-ESC | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-ESI | 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| W3H32M64E-667SBI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Trays 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H32M64E-667SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR2, 1.8V, 667MHZ, 208PBGA MIL-TEMP. - Bulk |
| W3H32M64EA-400SBM | 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3H32M64E-ES | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
| W3H32M64E-ESC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package |
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