參數(shù)資料
型號(hào): W3H32M64E-ES
英文描述: 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
中文描述: 32M的× 64 DDR2 SDRAM的208 PBGA封裝多芯片封裝
文件頁(yè)數(shù): 5/6頁(yè)
文件大?。?/td> 240K
代理商: W3H32M64E-ES
W3H32M64E-XSBX
5
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
October 2005
Rev. 3
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specifications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR2 SDRAM
CONFIGURATION, 32M x 64
1.8V Power Supply
DATA RATE (Mbs)
400 = 400Mbs
533 = 533Mbs
667 = 667Mbs
Blank = No datarate specified for ES product
(1)
PACKAGE:
ES = Non Qualified Product
(1)
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
I = In dus ri al
C = Com mer cial 0°C to +70°C
Blank = No temperature specified for ES product
(1)
-55°C to +125°C
-40°C to +85°C
W 3H 32M 64 E - XXX SB X
Note 1: W3H32M64E-ESSB is the only available product until completion of qualification.
相關(guān)PDF資料
PDF描述
W3H32M64E-ESC 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESI 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESM 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SB 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SBC 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W3H32M64E-ESC 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESI 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-ESM 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SB 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M64E-SBC 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package