參數(shù)資料
型號: W3H32M72E-667SBC
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: DRAM
英文描述: 32M X 72 DDR DRAM, 0.65 ns, PBGA208
封裝: 18 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
文件頁數(shù): 22/31頁
文件大?。?/td> 873K
代理商: W3H32M72E-667SBC
W3H32M72E-XSBX
29
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
July 2009
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR2 SDRAM
CONFIGURATION, 32M x 72
1.8V Power Supply
DATA RATE (Mbs)
400 = 400Mbs CL3
533 = 533Mbs CL4
667 = 667Mbs CL5
PACKAGE:
SB = 208 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3H 32M 72 E - XXX SB X
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相關代理商/技術參數(shù)
參數(shù)描述
W3H32M72E-667SBI 制造商:Microsemi Corporation 功能描述:32M X 72 DDR2, 1.8V, 667MHZ, 208PBGA INDUSTRIAL TEMP. - Bulk
W3H32M72E-667SBM 制造商:PMG/Microsemi 功能描述:
W3H32M72E-ES 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-ESC 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
W3H32M72E-ESI 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package