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參數(shù)資料
| 型號： | W671530P |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | TELECOM-SLIC, PQCC28 |
| 封裝： | PLASTIC, LCC-28 |
| 文件頁數(shù)： | 22/42頁 |
| 文件大?。?/td> | 1230K |
| 代理商： | W671530P |
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W671500 SERIES
9.3. THERMAL INFORMATION
Condition
Value
Thermal Resistance (Typical)
PLCC
[1]
QFN
[2]
ΘJA (°C/W)
ΘJC (°C/W)
53
N/A
27
1
Maximum Junction Temperature Plastic
150°C
Maximum Storage Temperature Range
-65°C to 150°C
Maximum Lead Temperature (Soldering 10s)
(PLCC – Lead Tips Only)
300°C
Notes:
[1] θJA for the PLCC package is measured with the component mounted on a low effective thermal conductivity test board in free
air.
[2] θJA for the QFN package is measured in free air with the component mounted on a high effective thermal conductivity test
board with direct attach features including conductive thermal vias.
θJC, the “case temp” is measured at the center of the
exposed metal pad on the package underside.
9.4. DIE CHARACTERISTICS
Condition
Value
Substrate Potential
VBH
Process
Bipolar-DI
CAUTION:
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only
rating and operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Publication Release Date: April 2004
- 29 -
Revision 1.0
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