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參數(shù)資料
| 型號(hào)： | W82M32V-12BM |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 2M X 32 MULTI DEVICE SRAM MODULE, 12 ns, PBGA255 |
| 封裝： | 25 X 25 MM, PLASTIC, BGA-255 |
| 文件頁(yè)數(shù)： | 7/7頁(yè) |
| 文件大?。?/td> | 219K |
| 代理商： | W82M32V-12BM |
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W82M32V-XBX
April, 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specications without notice.
Document Title
2M x 32 Asynchronous SRAM
Revision History
Rev # History
Release Date
Status
Rev 0 Initial Release
July 2002
Advanced
Rev 1 Changes
October 2002
Advanced
1.1 Add AC/DC Electricals & Timing Diagrams (Pg. 1-7)
1.2 Change Pinout to full 255 (16x16) array
1.3 Change Package Dimension to full 255 (16x16) array
Rev 2 Changes (Pg.1,5,6,7)
May 2002
Advanced
2.1 Change package dimension from 27mm square to 25mm square
2.2 Change package height from 2.20mm to 2.70mm Max
Rev 3 Changes (Pg.1,5,7)
November 2003
Advanced
3.1 Change package mechanical drawing to new format.
Rev 4 Changes (Pg.1,7)
May 2004
Preliminary
4.1 Change status to preliminary.
Rev 5 Changes (Pg. 1, 7)
April 2006
Final
5.1 Change status to Final
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W82M32V-XBX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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| W82MV-NSBM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:2Mx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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