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參數(shù)資料
| 型號： | W83176R-705 |
| 英文描述： | SiS 635/640/645/735/740 DDR 3-DIM DRAM Buffer |
| 中文描述： | 矽統(tǒng)635/640/645/735/740的DDR 3內(nèi)存緩沖區(qū)尺寸 |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 324K |
| 代理商： | W83176R-705 |
W83176R-705
Publication Release Date: April. 2002
6.0 ORDERING INFORMATION
Part Number
Package Type
Production Flow
W83176R-705
48 PIN SSOP
Commercial, 0
°
C to +70
°
C
7.0 HOW TO READ THE TOP MARKING
- 7 - Revision 1.0
W83176R-705
28051234
814GAB
1st line: Winbond logo and the type number: W83176R-705
2nd line: Tracking code 2 8051234
2
: wafers manufactured in Winbond FAB 2
8051234
: wafer production series lot number
3rd line: Tracking code 814 G B B
814
: packages made in '98, week 14
G
: assembly house ID; O means OSE, G means GR
A
: Internal use code
B
: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to their respective
owners.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W83176R-716 | SiS 635/640/645/735/740 DDR 2-DIM DRAM Buffer |
| W83194BR-250 | Step-less Frequency VIA Pro266/PL266 Clock Gen. |
| W83194BR-323 | Step-less Intel 845 Single Chip Clock including Buffer. with S.S.T. |
| W83194BR-640 | Step-less Frequency SiS 633/635/640 Main Clock Gen. |
| W83196R-718 | VIA Buffer Chip(4*DDR or 2*DDR + 3*SDRAM) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W83176R-716 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SiS 635/640/645/735/740 DDR 2-DIM DRAM Buffer |
| W83176R-732 | 制造商:WINBOND 功能描述: |
| W83176R-732_06 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:2 DIMM DDR ZERO DELAY buffer for Sis chipset |
| W83176R-733 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:Winbond Dual Bank DDR BUFFER For VIA CHIPSET |
| W83176R-735 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:DIMM DDR ZERO DELAY BUFFER |
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