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72
Ohmite Mfg. Co.
Mounting
Surface
Te
mp.
Rise
above
Ambient
(°
C)
Heat Dissipated (watts)
150
50
0
12
4
200
100
2
8
16
20
Free
Air
250
Thermal
Resistance
from
Mounting
Surface
to
Ambient
(°
C/watts)
14
6
2
0
8
4
10
12
800
400
200
600
1000
Air Velocity (ft./min.)
Air Flow
along Fins
Air Flow
Side to Side
T220-101E
T247-101E,
T264-101E
Hea t Dissip a tion
T220-101E, T247-101E and T264-101E
DT2-101E
W Series Heatsinks
For to-220, to-247, and to-264 devices
For
ohmite
surface
Heatsink
package Resistor
area
thermal
part number
type
series
(in2)
Weight
Resistance*
Wa-t220-101e TO-220 TBH25, TCH35 6.5 0.35 oz/10g Rs-a=12°C/W
WV-t220-101e
Rs-a=13°C/W
Wa-t247-101e TO-247 TEH70, TEH100 8.4 0.42 oz/12g Rs-a=11°C/W
WV-t247-101e
Rs-a=12°C/W
Wa-t264-101e TO-264 TFH85
8.4 0.42 oz/12g Rs-a=11°C/W
WV-t264-101e
Rs-a=12°C/W
Wa-Dt2-101e TO-220 TBH25, TCH35, 15.1 0.79 oz/22g Rs-a=7°C/W
WV-Dt2-101e & TO-247 TEH70, TEH100
Rs-a=8°C/W
*Natural convection at 10W heat dissipation
0.63"
(16.0mm)
0.72" (18.3mm)
0.92" (23.4mm)
T220
1.20"
(30.5mm)
T247, T264
1.20-1.26"
(30.5-32.0mm)
0.14"
(3.6mm)
0.50" (12.7mm)
0.71" (18.0mm)
Pin diameter
0.06" (1.5mm)
T220
T247, T264
T220
T247, T264
The unique design (patent pending) of the W Series heat sinks
combines a tin plated, solderable, integral spring clip with an
extruded aluminum heat sink body for an all-in-one solution to
through-hole mounting of TO-220, TO-247, and TO-264 packag-
es. These self-aligning heat sinks feature solderable feet and an
integrated clip with 13.2 (lbf) of force on the center of the device
to enhance thermal performance.
T220-101E
T247-101E
T264-101E
0.63"
(16.0mm)
0.08"
(2.0mm)
0.18"
(4.6mm)
CL
0.050"
(1.3mm)
0.080"
(2.0mm)
0.27"
(6.9mm)
0.06"
(1.5mm)
0.72"
(18.3mm)
0.92"
(23.4mm)
T220
T247
0.500"
(12.7mm)
0.92"
(23.4mm)
0.59"
(15.0mm)
0.785"
(19.4mm)
0.80"
(20.2mm)
T264
0.711"
(18.1mm)
0.711"
(18.1mm)
1.71" (43.4mm)
0.500"
(12.7mm)
0.63"
(16.0mm)
0.08"
(2.0mm)
0.18"
(4.6mm)
CL
0.080"
(2.0mm)
0.28"
(16mm)
0.711"
(18.1mm)
0.050" typ.
(1.3mm)
0.89" (22.6mm)
0.59"
(15mm)
0.785"
(19.4mm)
DT2
100
Mounting
Surface
Te
mp.
Rise
above
Ambient
(°
C)
Heat Dissipated (watts)
60
20
0
12
4
80
40
2
8
16
20
Free
Air
140
Thermal
Resistance
from
Mounting
Surface
to
Ambient
(°
C/watts)
6
2
0
8
4
10
12
800
400
200
600
1000
Air Velocity (ft./min.)
Air Flow
along Fins
Air Flow
Side to Side
120
DT2-101E
100
St andard p ar t number S For W Serie S
part number
Description
packaging
WA-T220-101E Heat sink for TO-220, black anodized
Bulk
WV-T220-101E Heat sink for TO-220, no finish (degreased)
Bulk
WA-T247-101E Heat sink for TO-247, black anodized
Bulk
WV-T247-101E Heat sink for TO-247, no finish (degreased)
Bulk
WA-T264-101E Heat sink for TO-264, black anodized
Bulk
WV-T264-101E Heat sink for TO-264, no finish (degreased)
Bulk
WA-DT2-101E
Heat sink for TO-247 &TO-220, black anodized
Bulk
WV-DT2-101E
Heat sink for TO-247 &TO-220, no finish (degreased) Bulk
Fea tu R es
ReducedAssemblyCost:
spring clip and auto-align feature
makes fasteners and fixtures
obsolete, along with stray metal
filings from tapped holes
MaximumRepeatability:clamp-
ing force of the spring clip is not
degraded by repeated loading
and unloading
MaximumHeatTransferper
UnitSpace:maximum surface
area per unit volume and con-
sistent mounting force reduces
thermal resistance
MaximumResistancetoShock
andVibration:light weight,
resilient spring clip locks the
component in place and is highly
resistant to shock and vibration
MaximumReliability:helps pre-
vent short circuits by eliminating
metal particles from thread tap-
ping
RoHS Compliant
s peci F ica tions
HeatSink:Aluminum alloy 6063-
T5 or equivalent.
SpringClip:Music wire, per
ASTM A228
Pin:Solderable 100% tin over
copper strike
Interfacethermalresistance:
for improvement, use thermal
joint compound or 0.005 Grafoil
(TGon 800 by Laird)
Interfaceelectricalisolation:
Sil-Pad 900S by Bergquist or
equivalent
Mounting: Vertical thru-hole
mount
ClipForce: 13.2 lbf.
Patent
Pending
DT2-101E
lan D p a tte R n