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參數(shù)資料
| 型號(hào)： | WE128K32-300G2UM |
| 廠商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 128K X 32 EEPROM 5V MODULE, 300 ns, CQFP68 |
| 封裝： | 22.40 MM, CERAMIC, LQFP-68 |
| 文件頁(yè)數(shù)： | 7/16頁(yè) |
| 文件大小： | 347K |
| 代理商： | WE128K32-300G2UM |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WE128K32-XXX
White Electronic Designs
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = Compliant
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex In-line Package, HIP (Package 400*)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 510)
G1U1 = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 519)
G1T = 23.9mm Ceramic Quad Flat Pack, Low Profile CQFP (Package 524)
ACCESS TIME (ns)
IMPROVEMENT MARK
N = No Connect at pins 8, 21, 28, and 39 in HIP for upgrade
P = Alternate Pin Configuration for HIP package
ORGANIZATION 128K x 32
User Configurable as 256K x 16 or 512K x 8
EEPROM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W E 128K32 X - XXX X X X
I/O0-31 Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
FIG. 12 ALTERNATE PIN CONFIGURATION FOR WE128K32NP-XH1X
PIN DESCRIPTION
BLOCK DIAGRAM
TOP VIEW
Note1:PackageNotRecommendedForNewDesign
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| WE128K32-300G4C | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 EEPROM Module |
| WE128K32-300G4CA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 EEPROM Module |
| WE128K32-300G4I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 EEPROM Module |
| WE128K32-300G4IA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 EEPROM Module |
| WE128K32-300G4M | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 EEPROM Module |
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