參數(shù)資料
型號(hào): WED3DG6319V75D2
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 16M X 64 SYNCHRONOUS DRAM MODULE, DMA168
封裝: DIMM-168
文件頁(yè)數(shù): 5/6頁(yè)
文件大小: 144K
代理商: WED3DG6319V75D2
Aug. 2002
Rev. 2
WED3DG6419V-D2
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
ALL DIMENSIONS ARE IN MILLIMETERS AND (INCHES)
3.99
(0.157)
(2X)
8.89
(0.350)
6.35
(0.250)
P1
11.43
(0.450)
3.18
(0.125) (2X)
133.48
(5.255 MAX.)
115.57
(4.550)
6.35
(0.250)
54.61
(2.150)
1.27
(0.050 ± 0.004)
3.99
(0.157 MIN.)
3.81
(0.150)
MAX.
30.48
(1.200)
MAX.
17.78
(0.700)
42.16
(1.660)
36.83
(1.450)
PACKAGE DIMENSIONS
ORDERING INFORMATION
Part Number
Speed
CAS Latency
WED3DG6319V10D2
100MHz
CL=2
WED3DG6319V7D2
133MHz
CL=2
WED3DG6319V75D2
133MHz
CL=3
Note: Available with "WP" Write Protect on pin 81.
Part Number
Speed
CAS Latency
WED3DG6419V10D2
100MHz
CL=2
WED3DG6419V7D2
133MHz
CL=2
WED3DG6419V75D2
133MHz
CL=3
Note: Modules are available in industrial temperature - 40°C to 85°C.
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參數(shù)描述
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