型號(hào): | WEDPNF8M722V-1212BM |
元件分類: | 存儲(chǔ)器 |
英文描述: | SPECIALTY MEMORY CIRCUIT, PBGA275 |
封裝: | 35 X 25 MM, PLASTIC, BGA-275 |
文件頁數(shù): | 37/41頁 |
文件大小: | 522K |
代理商: | WEDPNF8M722V-1212BM |
相關(guān)PDF資料 |
PDF描述 |
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WEDPNF8M722V-1012BC | SPECIALTY MEMORY CIRCUIT, PBGA275 |
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WF1024K32-100HSM | 4M X 8 FLASH 12V PROM MODULE, 100 ns, CHIP66 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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WEDPNF8M722V-1215BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
WEDPNF8M722V-1215BI | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
WEDPNF8M722V-1215BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
WEDPNF8M722V-XBX | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:8Mx72 Synchronous DRAM + 16Mb Flash Mixed Module Multi-Chip Package |
WEDPS512K32-12BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |