型號: | WEDPS512K32-12BI |
廠商: | MICROSEMI CORP-PMG MICROELECTRONICS |
元件分類: | SRAM |
英文描述: | 512K X 32 MULTI DEVICE SRAM MODULE, 12 ns, PBGA143 |
封裝: | 16 X 18 MM, PLASTIC, BGA-143 |
文件頁數(shù): | 3/7頁 |
文件大?。?/td> | 235K |
代理商: | WEDPS512K32-12BI |
相關(guān)PDF資料 |
PDF描述 |
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WEDPS512K32-20BC | 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, PBGA143 |
WEDPS512K32-15BI | 512K X 32 MULTI DEVICE SRAM MODULE, 15 ns, PBGA143 |
WF8M32-150G4DC5 | 8M X 32 FLASH 5V PROM MODULE, 150 ns, CQFP68 |
WML-C04 | SPECIALTY TELECOM CIRCUIT, XMA17 |
WML-C10 | SPECIALTY TELECOM CIRCUIT |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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WEDPS512K32-12BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-15BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-15BI | 制造商:White Electronic Designs 功能描述:SRAM Module Asynchronous 16Mbit |
WEDPS512K32-15BM | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |
WEDPS512K32-17BC | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:512Kx32 SRAM MULTI-CHIP PACKAGE |