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參數(shù)資料
| 型號(hào)： | WF1M32B-100G2UI3 |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68 |
| 封裝： | 0.140 X 0.140 INCH, 3.50 MM HEIGHT, CERAMIC, QFP-68 |
| 文件頁數(shù)： | 11/13頁 |
| 文件大?。?/td> | 600K |
| 代理商： | WF1M32B-100G2UI3 |
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
s
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er
d
A
CS#
E#
O
E#
W
at
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0.
5
A
P
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H
5
t
C
W
t
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C
D
P
D#
7
D
T
U
O
t
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A
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P
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D
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S
D
Data#
Polling
t
S
A
t
C
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W
H
0
A
0
A
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E
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F
D
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W
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WF1M32B-100H1I3 | 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66 |
| WF1M32B-150HC3A | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-150HI3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-150HM3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-120G2TC3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WF1M32B-100HC3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-100HC3A | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-100HC5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HC5A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Flash EEPROM Module |
| WF1M32B-100HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 100NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
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