參數(shù)資料
型號: WF1M32B-100H1I3
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁數(shù): 2/13頁
文件大小: 600K
代理商: WF1M32B-100H1I3
10
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
ALTERNATE CS# CONTROLLED PROGRAMMING OPERATION TIMINGS
s
e
s
er
d
A
E#
W
E#
O
S#
C
at
a
D
V
0.
5
A
P
A
P
H
5
t
C
W
t
S
W
D
P
D#
7
D
T
U
O
t
H
A
t
H
P
C
t
P
C
t
H
D
t
S
D
Data#
Polling
t
S
A
t
L
E
H
G
H
0
A
t
1
H
W
H
W
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