參數(shù)資料
型號(hào): WF1M32B-120H1C3
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類(lèi): PROM
英文描述: 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CPGA66
封裝: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件頁(yè)數(shù): 3/13頁(yè)
文件大小: 600K
代理商: WF1M32B-120H1C3
11
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WF1M32B-XXX3
March 2007
Rev. 6
White Electronic Designs Corp. reserves the right to change products or specications without notice.
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
oo
0.940" TYP
The White 68 lead G2U CQFP lls the same t
and function as the JEDEC 68 lead CQFJ or
68 PLCC. But the G2U has the TCE and lead
inspection advantage of the CQFP form.
相關(guān)PDF資料
PDF描述
WF1M32B-100G2UI3 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CQFP68
WF1M32B-100H1I3 1M X 32 FLASH 3.3V PROM MODULE, 100 ns, CPGA66
WF1M32B-150HC3A 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66
WF1M32B-150HI3 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66
WF1M32B-150HM3 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
WF1M32B-120HC3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk 制造商:White Electronic Designs 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk
WF1M32B-120HC3A 制造商:WEDC 制造商全稱(chēng):White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module
WF1M32B-120HC5 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 Flash EEPROM Module
WF1M32B-120HC5A 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 Flash EEPROM Module
WF1M32B-120HI3 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk 制造商:White Electronic Designs 功能描述:1M X 32 FLASH MODULE, 3.3V, 120NS, BOOT BLOCK, 66 PGA 1.185" - Bulk