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參數(shù)資料
| 型號： | WF1M32B-150HC3A |
| 元件分類： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| 封裝： | PGA TYPE, CERAMIC, HIP-66 |
| 文件頁數(shù)： | 2/13頁 |
| 文件大?。?/td> | 159K |
| 代理商： | WF1M32B-150HC3A |
10
White Electronic Designs Corporation Phoenix, AZ (602) 437-1520
WF1M32B-XXX3
NOTES:
1. PA represents the address of the memory location to be programmed.
2. PD represents the data to be programmed at byte address.
3. D7 is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates the last two bus cycles of a four bus cycle sequence.
Addresses
WE
OE
CS
Data
AAAH
PA
tWC
tWS
PD
D
7
D
OUT
tAH
tCPH
tCP
tDH
tDS
Data
Polling
tAS
tGHEL
A0H
tWHWH1
ALTERNATE CS CONTROLLED
PROGRAMMING OPERATION TIMINGS
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WF1M32B-150HI3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-150HM3 | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CHIP66 |
| WF1M32B-120G2TC3 | 1M X 32 FLASH 3.3V PROM MODULE, 120 ns, CQFP68 |
| WF1M32C-100H2M | 4M X 8 FLASH 12V PROM MODULE, 100 ns, CPGA66 |
| WF1M32E-150G2M | 4M X 8 FLASH 12V PROM MODULE, 150 ns, QMA68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HM3A | 制造商:WEDC 制造商全稱:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32BP-100G2TI5A | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 Flash EEPROM Module |
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