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參數(shù)資料
| 型號： | WH1222 |
| 廠商： | SEOUL SEMICONDUCTOR CO LTD |
| 元件分類： | LED |
| 英文描述： | CHIP LED DEVICE |
| 中文描述： | SINGLE COLOR LED, WHITE, 3.5 mm |
| 文件頁數(shù)： | 5/8頁 |
| 文件大小： | 358K |
| 代理商： | WH1222 |
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150
℃
max. for 2 minutes max.
-Soldering heat to be at 240
℃
max. for 5 seconds max.
Temperature
rise: 5°C/sec.
-5°C/sec.
Cooling:
Pre-heating
Operation heating
60 to 120 sec.
5sec. max
120
150
240
°C
0
~
L
(2) Lead-Free Solder
-Preliminary heating to be at 150
℃
max. for 2 minutes max.
-Soldering heat to be at 260
℃
max. for 10 seconds max.
~
120
60 to 120 sec.
0
150
L
°C
Pre-heating
rise: 5°C/sec.
Temperature
Operation heating
-5°C/sec.
Cooling:
260
5 to 10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280
℃
, under Soldering iron.
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
- 5/8-
SSC-WH1222
SSC-QP-0401-06(REV.0)
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