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參數(shù)資料
| 型號： | WPF-1608-122MT |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 1.2 uH, FERRITE-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 1608, ROHS COMPLIANT |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 519K |
| 代理商： | WPF-1608-122MT |
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380
www.worldproducts.com
091605 Rev. 16.0
6
FERRITE INDUCTORS
Reliability and Test Conditions
REQUIREMENTS
ITEM
1608
2012
3216
TEST CONDITION
Operating temp.range
-55°C~+125°C
-
Storage temp. & humidity range
40°C max. , 70% RH max.
at packing condition
Resistance to solder heat
1. No damage such as cracks should be caused in chip
element.
2. More than 75% of the terminal electrode shall be
covered with new solder.
3. Inductance change: ±within 5%
4. Quality factor change: ±within 30%
Preheat temperature: 100 to 150°C
Preheat time: 1min
Solder temperature: 260 ± 10°C
Dipping time: 10 ± 0.5sec.
Solderability
1. More than 90% of the terminal electrode shall be
covered with new solder.
2. Inductance change : ± within 5%
3. Quality factor change : ± within 30%
Preheat temperature: 100 to 150°C
Preheat time: 1min
Solder temperature: 230 ± 10°C
Dipping time: 3 ± 1sec.
Reflow soldering
1. More than 50% of the terminal electrode shall be
covered with new solder.
T
S
T * 0.5
Preheat temperature: 150°C
Preheat time: 1min
Solder temperature: 230°C
Soldering time: 10 sec. Max.
(Reflow soldering profile)
1. No mechanical damage.
Tensile strength
(Terminal strength)
Unit : Kgf(W)
W
1.0
2.0
2.5
W(kgf) min
W
1. No mechanical damage
Adhension of Terminal electrode
(Flexure strength)
Unit : mm (a,b,c), Kgf(W)
a
1.0
1.3
b
0.8
1.0
1.5
c
1.3
3.0
W
2.0
4.0
5.0
c
a
b
a
W
R 0.5
Land
1. The body shall not be damaged by forces applied (see
illustration.)
Body strength (Bending strength)
Unit : mm (d), Kgf(W)
d
1.3
2.0
W
2.0
3.0
4.0
d
R 0.5
1.0mm
W
T
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