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參數(shù)資料
| 型號： | WPM-I0603-2.7ST |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.0027 uH, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP |
| 文件頁數(shù)： | 4/8頁 |
| 文件大?。?/td> | 1559K |
| 代理商： | WPM-I0603-2.7ST |
WORLD PRODUCTS INC.
19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380
www.worldproducts.com
071404 Rev.4.0
MICRO INDUCTORS
Reliability and Test Conditions
ITEM
REQUIREMENTS
TEST CONDITION
Operating temp.
range
Storage temp. &
humidity range
-55
°
C~+125
°
C
≥
-
-40
°
C max. , 70% RH max.
at packing condition
Resistance to
solder heat
1.No damage such as cracks should be visible in chip element.
2.More than 75% of the terminal electrode shall be covered with new
solder.
3.Inductance change : ±within 5%
4.Quality factor change : ±within 30%
Preheat
temperature : 100 to 150
°
C
Preheat time : 1min
Solder
temperature : 260 ±10
°
C
Dipping time : 10 ±0.5sec.
Preheat
temperature : 100 to 150
°
C
Preheat time : 1min
Solder
temperature : 230 ±10
°
C
Dipping time : 3 ±1sec.
Preheat
temperature : 150
°
C
Preheat time : 1min
Solder
temperature : 230
°
C
Soldering time : 10 sec.
max.
(Reflow soldering profile)
Solderability
1.More than 90% of the terminal electrode shall be covered with new
solder.
2.Inductance change : ±within 5%
3.Quality factor change : ±within 30%
Reflow soldering
1.More than 50% of the terminal electrode shall be covered with new
solder.
Bending Test
1.No mechanical damage.
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