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參數(shù)資料
| 型號： | WS128K32-120H1M |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 120 ns, CPGA66 |
| 封裝： | 1.075 X 1.075 MM, CERAMIC, PGA-66 |
| 文件頁數(shù)： | 1/9頁 |
| 文件大?。?/td> | 379K |
| 代理商： | WS128K32-120H1M |
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WS128K32-XXX
June 2004
Rev. 4
128Kx32 SRAM MODULE, SMD 5962-93187
5 Volt Power Supply
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight
WS128K32-XG2UX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX - 20 grams typical
Upgradeable to 512Kx32
FEATURES
Access Times of 70, 85, 100, 120ns
MIL-STD-883 Compliant Devices Available
Packaging
66-pin, PGA Type, 1.075 inch square, Hermetic
Ceramic HIP (Package 400).
68 lead, 40mm Low Prole CQFP, 3.56mm
(0.140")(Package 502).
68 lead, Hermetic CQFP (G2U), 22.4mm
(0.880 inch) square, 4.57mm (0.140 inch) high,
(Package 510)
Organized as 128Kx32; User Congurable as
256Kx16 or 512Kx8
Commercial, Industrial and Military Temperature
Ranges
Pin Description
Block Diagram
Top View
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
I/O8
I/O9
I/O10
A14
A16
A11
A0
NC
I/O0
I/O1
I/O2
WE2#
CS2#
GND
I/O11
A10
A9
A15
VCC
CS1#
NC
I/O3
I/O15
I/O14
I/O13
I/O12
OE#
NC
WE1#
I/O7
I/O6
I/O5
I/O4
I/O24
I/O25
I/O26
A7
A12
NC
A13
A8
I/O16
I/O17
I/O18
VCC
CS4#
WE4#
I/O27
A4
A5
A6
WE3#
CS3#
GND
I/O19
I/O31
I/O30
I/O29
I/O28
A1
A2
A3
I/O23
I/O22
I/O21
I/O20
11
22
33
44
55
66
1
12
23
34
45
56
WE1#CS1#CS2#CS3#CS4#
WE4#
WE3#
WE2#
128K x 8
OE#
A0-16
I/O0-7
I/O24-31
I/O16-23
I/O8-15
88
8
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE1-4#
Write Enables
CS1-4#
Chip Selects
OE#
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
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| WS128K32-85H1IA | 128K X 32 MULTI DEVICE SRAM MODULE, 85 ns, CPGA66 |
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| WS128K32-70G1UM | 128K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CQMA68 |
| WS128K32-70G1UI | 128K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CQMA68 |
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