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參數(shù)資料
| 型號(hào)： | WS128K32-55G2TIA |
| 元件分類(lèi)： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| 封裝： | 22.40 MM, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 156K |
| 代理商： | WS128K32-55G2TIA |
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
G1U = 22.4mm Ceramic Quad Flat Pack, Low Provile CQFP (Package 519)
G4T = 40 mm Low Profile CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
L = Low Power
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
W S
128K 32 X - XXX X X X
WS128K32-XXX
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS128K32-17H1I | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS128K32-25H1IA | 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66 |
| WS128K32-55H1IA | 128K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CPGA66 |
| WS128K32L-15G2TQA | 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQMA68 |
| WS128K32L-35G2TQA | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQMA68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32-55G2TM | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 SRAM Module |
| WS128K32-55G2TQ | 制造商:未知廠家 制造商全稱(chēng):未知廠家 功能描述:x32 SRAM Module |
| WS128K32-55G2UC | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 55NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk |
| WS128K32-55G2UI | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 55NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk |
| WS128K32-55G2UM | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 55NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk |
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