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參數(shù)資料
| 型號： | WS128K32NV-20G2TMA |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | SRAM |
| 英文描述： | 128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| 中文描述： | 128Kx32 3.3V的SRAM的多芯片封裝 |
| 文件頁數(shù)： | 8/8頁 |
| 文件大?。?/td> | 98K |
| 代理商： | WS128K32NV-20G2TMA |
8
White Microelectronics Phoenix, AZ (602) 437-1520
4
S
WS128K32V-XXX
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M= Military Screened
I = Industrial
C = Commercial
-55
°
C to +125
°
C
-40
°
C to +85
°
C
0
°
C to +70
°
C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2T = 22.4mm CQFP (Package 509)
G1U = 23.8mm Low Profile CQFP (Package 519)
ACCESS TIME (ns)
Low Voltage Supply 3.3V
±
10%
IMPROVEMENT MARK:
N = No Connect at pins 8, 21, 28, 39 in HIP for upgrade.
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
ORDERING INFORMATION
W S 128K 32 X V - XXX X X X
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS128K32NV-20H1C | 128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32NV-20H1CA | 128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32NV-20H1I | 128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32NV-25G1UCA | 128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32NV-25G1UI | 128Kx32 3.3V SRAM MULTICHIP PACKAGE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS128K32NV-20H1C | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 20NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS128K32NV-20H1CA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32NV-20H1I | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 20NS, NO CONNECT, 66 PGA 1.075" - Bulk |
| WS128K32NV-20H1IA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32NV-20H1M | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 20NS, NO CONNECT, 66 PGA 1.075" - Bulk |
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