參數(shù)資料
型號(hào): WS1M32V-17G3X
英文描述: 1Mx32 3.3V SRAM Module(1Mx32,3.3V,靜態(tài)RAM模塊(存取時(shí)間17ns))
中文描述: 1Mx32 3.3靜態(tài)存儲(chǔ)器模塊(1Mx32,3.3伏,靜態(tài)內(nèi)存模塊(存取時(shí)間17ns))
文件頁數(shù): 5/6頁
文件大?。?/td> 155K
代理商: WS1M32V-17G3X
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS1M32V-XG3X
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 511:
84 LEAD, CERAMIC QUAD FLAT PACK (G3)
0.38 (0.015)
±
0.05 (0.002)
4.12 (0.162)
±
0.20 (0.008)
1.27 (0.050) TYP
2 0.25 (0.010)
±
25.40 (1.000) TYP
4.29 (0.169)
±
0.28 (0.011)
0 0.06 (0.003)
±
1.02 (0.040)
±
0.12 (0.005)
0.03 (0.002)
±
1
°
/ 7
°
R 0.127
DETAIL A
SEE DETAIL "A"
Pin 1
0.27 (0.011)
±
0.04 (0.001)
+
30.23 (1.190)
±
0.25 (0.010) SQ
27.18 (1.070)
±
0.25 (0.010) SQ
The WEDC 84 lead G3 CQFP fills
the same fit and function as the
JEDEC 84 lead CQFJ or 84 PLCC.
But the G3 has the TCE and lead
inspection advantage of the
CQFP form.
1.146"
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