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參數(shù)資料
| 型號(hào)： | WS512K32-55G2UQ |
| 廠商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| 封裝： | 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件頁(yè)數(shù)： | 10/11頁(yè) |
| 文件大?。?/td> | 577K |
| 代理商： | WS512K32-55G2UQ |
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial
-40°C to 85°C
C = Commercial
0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 510)
G2L = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 528)
G4T1 = 40mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
Blank = Standard Power
N = No Connect at pin 21 and 39 in HIP for Upgrades
L = Low Power Data Retention
ORGANIZATION, 512Kx32
User congurable as 1Mx16 or 2Mx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
W S 512K 32 X - XXX X X X
Note 1: Package Not Recommended For New Design
ORDERING INFORMATION
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WS512K32L-55G4TCA | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WS512K32N-45H1M | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66 |
| WS512K32N-45H1IA | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CPGA66 |
| WS512K32N-45G2UQ | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68 |
| WS512K32N-45G2LQA | 512K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| WS512K32-55G4TC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
| WS512K32-55G4TCA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-55G4TI | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
| WS512K32-55G4TIA | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:x32 SRAM Module |
| WS512K32-55G4TM | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|QFL|68PIN|CERAMIC |
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