參數(shù)資料
型號: WS512K32N-25G4TI
廠商: WHITE ELECTRONIC DESIGNS CORP
元件分類: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
封裝: 40 X 40 MM, 3.50 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
文件頁數(shù): 8/11頁
文件大?。?/td> 577K
代理商: WS512K32N-25G4TI
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS512K32-XXX
May 2006
Rev. 17
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 400: 66 PIN, PGA TYPE, CERAMIC HEX-IN-LINE PACKAGE, HIP (H1)
4.60 (0.181)
MAX
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
Note 1: Package Not
Recommended
For New Design
PACKAGE 502: 68 LEAD, CERAMIC QUAD FLAT PACK, LOW PROFILE CQFP (G4T)1
相關(guān)PDF資料
PDF描述
WS512K32N-25G2LMA 512K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
WS1M32-25H2MA 1M X 32 MULTI DEVICE SRAM MODULE, 25 ns, CPGA66
W947D6HBHX5E 8M X 16 DDR DRAM, 5 ns, PBGA60
WS57C256F-70LMB 32K X 8 UVPROM, 70 ns, CQCC32
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WS512K32N-25H1C 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 25NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-25H1CA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-25H1I 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 25NS, NO CONNECT, 66 PGA 1.075" S - Bulk
WS512K32N-25H1IA 制造商:未知廠家 制造商全稱:未知廠家 功能描述:SRAM|512KX32|CMOS|PGA|66PIN|CERAMIC
WS512K32N-25H1M 制造商:White Electronic Designs 功能描述:Conn Terminal Block 3 POS 5.08mm Solder ST Thru-Hole 13.5A 制造商:Microsemi Corporation 功能描述:512K X 32 SRAM MODULE, 5V, 25NS, NO CONNECT, 66 PGA 1.075" S - Bulk